Modeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit Boards and Packaging

Modeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit Boards and Packaging Front Cover
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2017-05-10
340 pages

Book Description

Modeling and of Electromagnetic Compatibility for High-Speed Printed Boards and Packaging presents the electromagnetic modelling and design of three major electromagnetic compatibility (EMC) issues related to the high-speed printed circuit board (PCB) and electronic packages: signal integrity (SI), power integrity (PI), and electromagnetic interference (EMI). The emphasis is put on two essential passive components of PCBs and packages: the power distribution and the signal distribution . This book includes two parts. Part one talks about the field-circuit methods used for the EMC modeling, including the modal method, the integral equation method, the cylindrical wave expansion method and the de-embedding method. Part two illustrates EMC design methods and explores the applications of novel metamaterials and two-dimensional materials on traditional EMC problems.

This book is designed to enhance worthwhile electromagnetic and methods for practical engineers and to train students with advanced EMC applications.

Table of Contents

Chapter 1: Electromagnetic Compatibility For High-Speed Circuits
Chapter 2: Modal Field Of Power–Ground Planes And Grids
Chapter 3: Integral Equation Solutions
Chapter 4: Extraction Of Via Parameters
Chapter 5: Printed Circuit Board-Level Electromagnetic Compatibility Design
Chapter 6: Interposer Electromagnetic Compatibility Design
Chapter 7: New Structures And Materials

Book Details

  • Title: Modeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit Boards and Packaging
  • Author:
  • Length: 340 pages
  • Edition: 1
  • Language: English
  • Publisher:
  • Publication Date: 2017-05-10
  • ISBN-10: 1138033561
  • ISBN-13: 9781138033566
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