This edition will help engineers improve their ability to verify, isolate, uncover, and identify the root cause of failures. Prepared by a team of experts, this updated reference offers the latest information on advanced failure analysis tools and techniques, illustrated with numerous real-life examples. Topics include: Failure Analysis Process and Management wafer, package, and board level failure analysis flow. Incoming Inspection Tools optical, x-ray, and scanning acoustic microscopy. Fault Isolation front and backside sample preparation, CAD navigation, laser-assisted device alteration (LADA), soft defect location (SDL), lock-in thermography, laser voltage probing (LVP), photon emission, EOTPR/TDR/TDT, and current imaging. Device and Circuit Characterization scanning electron microscopy (SEM)-based and atomic force microscopy (AFM)-based nanoprobing. FIB Technique and Circuit Edit FIB overview and advanced circuit edit for first silicon debug. Physical Analysis deprocessing, cross section analysis, scanning electron microscopy, material analysis techniques, transmission electron microscopy (TEM), and scanning probe microscopy. Memory FA DRAM, semiconductor memory failure signature analysis. Special Applications automotive FA, 2.5 and 3D packaging failure analysis, microelectromechanical systems (MEMS), optoelectronics, solar, and counterfeit electronics. Fundamental Topics integrated circuit testing, analog design, reliability, quality, and training. Seven new topics have been added and all themes covered in earlier editions are included in the Seventh Edition. Many previous articles have been updated.